Bonded fin heatsinks use a stamped or pre-fabricated plate that is bonded into a channel located on a heatsink base plate using thermally conductive epoxy. These heatsinks can dissipate two to three times more heat than conventional extruded heatsinks by adding 200% to 300% to the cooling surface area. Fin density and height can be configured in countless combinations. TechSource offers total flexibility in the design and manufacturing of our bonded fin heatsinks. Our engineers are prepared to work with your designs to ensure the most economical part configuration at the optimal performance level.

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